Parastak™

ParaStak™: A whole new level of circuit miniaturization and integration!

When Paratek developed ParaScan, an entirely new world of RF tuning possibilities opened up! Taking this remarkable technology and making it better is ParaStak,™ a proprietary 3-D miniaturization design methodology for fabricating RF circuitry. ParaStak can take a conventional two-dimension circuit and significantly reduce its size and overall footprint by 'stacking' RF components and functional blocks. The mobile wireless industry is calling for higher levels of component miniaturization, performance, and integration. ParaStak is the perfect solution to meet these market demands...all at no additional cost! Best of all, it's perfectly suited for RF applications since it allows for easy and direct RF component tuning.

ParaStak achieves these objectives by drawing upon established packaging materials and technologies rather than unproven and potentially costly ones. This means a low-risk path to high-volume production. Benefits of this approach include faster time-to-market and better control over costs. ParaStak technology uses two-layer BT substrates with through vias—in contrast to conventional 2-D fabrication techniques that require a four-layer BT substrate with blind and buried vias. Since each ParaStak circuit block shrinks to roughly one-half the size of a conventional 2-D circuit, dramatic reductions in component size can be achieved. In addition, ParaStak requires no compromise in substrate selection for RFICs that need both low Z and H for optimal RF and thermal grounding, and high Z, H, and Q for the most efficient output matching networks.